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 2N6387, 2N6388
2N6388 is a Preferred Device
Plastic Medium-Power Silicon Transistors
These devices are designed for general-purpose amplifier and low-speed switching applications.
Features http://onsemi.com
* High DC Current Gain - hFE = 2500 (Typ) @ IC = 4.0 Adc * Collector-Emitter Sustaining Voltage - @ 100 mAdc * * * *
VCEO(sus) = 60 Vdc (Min) - 2N6387 = 80 Vdc (Min) - 2N6388 Low Collector-Emitter Saturation Voltage - VCE(sat) = 2.0 Vdc (Max) @ IC = 5.0 Adc - 2N6387, 2N6388 Monolithic Construction with Built-In Base-Emitter Shunt Resistors TO-220AB Compact Package Pb-Free Packages are Available*
DARLINGTON NPN SILICON POWER TRANSISTORS 8 AND 10 AMPERES 65 WATTS, 60 - 80 VOLTS
MARKING DIAGRAM
MAXIMUM RATINGS (Note 1)
Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous - Peak Base Current Total Power Dissipation @ TC = 25_C Derate above 25_C Total Power Dissipation @ TA = 25_C Derate above 25_C Operating and Storage Junction, Temperature Range 2N6387 2N6388 2N6387 2N6388 Symbol VCEO VCB VEB IC IB PD PD TJ, Tstg Value 60 80 60 80 5.0 10 15 250 65 0.52 2.0 0.016 -65 to +150 Unit Vdc Vdc Vdc Adc mAdc W W/C W W/C C 2N6387 Symbol RqJC RqJA Max 1.92 62.5 Unit _C/W _C/W 2N6387G 2N6388 2N6388G
4 TO-220AB CASE 221A STYLE 1 1 2N638xG AYWW
2
3
2N638x = Device Code x = 7 or 8 G = Pb-Free Package A = Assembly Location Y = Year WW = Work Week
ORDERING INFORMATION
Device Package TO-220AB TO-220AB (Pb-Free) TO-220AB TO-220AB (Pb-Free) Shipping 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail
THERMAL CHARACTERISTICS
Characteristics Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Indicates JEDEC Registered Data.
Preferred devices are recommended choices for future use and best overall value.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
1
August, 2006 - Rev. 12
Publication Order Number: 2N6387/D
2N6387, 2N6388
TA 4.0 PD, POWER DISSIPATION (WATTS) TC 80
3.0
60 TC
2.0
40 TA
1.0
20
0
0
20
40
60 80 100 T, TEMPERATURE (C)
120
140
160
Figure 1. Power Derating
II I III I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I II I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II IIIIII I I II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I III I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted) (Note 2)
Characteristic OFF CHARACTERISTICS Symbol Min Max Unit Collector-Emitter Sustaining Voltage (Note 3) (IC = 200 mAdc, IB = 0) Collector Cutoff Current (VCE = 60 Vdc, IB = 0) (VCE = 80 Vdc, IB = 0) VCEO(sus) Vdc 2N6387 2N6388 2N6387 2N6388 60 80 - - - - - - - - - ICEO mAdc 1.0 1.0 Collector Cutoff Current (VCE = 60 Vdc, VEB(off) = 1.5 Vdc) (VCE - 80 Vdc, VEB(off) = 1.5 Vdc) (VCE = 60 Vdc, VEB(off) = 1.5 Vdc, TC = 125_C) (VCE = 80 Vdc, VEB(off) = 1.5 Vdc, TC = 125_C) Emitter Cutoff Current (VBE = 5.0 Vdc, IC = 0) ICEX mAdc 2N6387 2N6388 2N6387 2N6388 300 300 3.0 3.0 5.0 mAdc IEBO mAdc ON CHARACTERISTICS (Note 3) DC Current Gain (IC = 5.0 Adc, VCE = 3.0 Vdc) (IC = 1 0 Adc, VCE = 3.0 Vdc) hFE - 2N6387, 2N6388 2N6387, 2N6388 1000 100 - - - - 20,000 - 2.0 3.0 2.8 4.5 Collector-Emitter Saturation Voltage (IC = 5.0 Adc, IB = 0.01 Adc) (IC = 10 Adc, IB = 0.1 Adc) Base-Emitter On Voltage (IC = 5.0 Adc, VCE = 3.0 Vdc) (IC = 10 Adc, VCE = 3.0 Vdc) VCE(sat) Vdc 2N6387, 2N6388 2N6387, 2N6388 2N6387, 2N6388 2N6387, 2N6388 VBE(on) Vdc DYNAMIC CHARACTERISTICS Small-Signal Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc, ftest = 1.0 MHz) Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) |hfe| Cob hfe 20 - - - 200 - pF - Small-Signal Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc, f = 1.0 kHz) 1000 2. Indicates JEDEC Registered Data. 3. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
http://onsemi.com
2
2N6387, 2N6388
RB AND RC VARIED TO OBTAIN DESIRED CURRENT LEVELS D1 MUST BE FAST RECOVERY TYPES, e.g., 1N5825 USED ABOVE IB [ 100 mA MSD6100 USED BELOW IB [ 100 mA V1
APPROX
VCC + 30 V RC SCOPE
TUT
RB 51 D1 [ 8.0 k [ 120
+ 12 V 0 V2
APPROX
-8V
25 ms
tr, tf v 10 ns DUTY CYCLE = 1.0%
- 4.0 V FOR td AND tr, D1 IS DISCONNECTED AND V2 = 0
Figure 2. Switching Times Test Circuit
7.0 5.0 3.0 ts tf t, TIME ( s) 1.0 0.7 0.3 0.2 0.1 0.07 0.1 VCC = 30 V IC/IB = 250 IB1 = IB2 TJ = 25C 0.2 tr
td
1.0 0.5 2.0 IC, COLLECTOR CURRENT (AMPS)
5.0
10
Figure 3. Switching Times
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0 0.7 0.5 0.3 0.2
D = 0.5 0.2 0.1 0.05 0.02 0.01 0.02 P(pk) ZqJC (t) = r(t) RqJC RqJC = 1.92C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) ZqJC(t) 0.2 0.5 1.0 2.0 5.0 t, TIME (ms) 10 20 50
0.1 0.07 0.05 0.03 0.02 0.01 0.01
t1 t2 DUTY CYCLE, D = t1/t2 100 200 500 1.0 k
SINGLE PULSE 0.05 0.1
Figure 4. Thermal Response
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3
2N6387, 2N6388
20 IC, COLLECTOR CURRENT (AMPS) 10 dc 50 ms 5 ms TJ = 150C BONDING WIRE LIMITED THERMALLY LIMITED @ TC = 100C SECOND BREAKDOWN LIMITED CURVES APPLY BELOW RATED VCEO 2N6387 2N6388 80 10 ms 50 ms 1 ms
5.0
2.0
1.0 0.5 0.2
0.1
0.03 1.0
10 20 2.0 4.0 6.0 40 60 VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC - VCE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 5 is based on T J(pk) = 150_C; TC is variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T J(pk) < 150_C. T J(pk) may be calculated from the data in Figure 4. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown
Figure 5. Active-Region Safe Operating Area
10,000 hFE , SMALL-SIGNAL CURRENT GAIN 5000 3000 2000 1000 500 300 200 100 50 30 20 10 1.0 2.0 5.0 10 20 50 100 f, FREQUENCY (kHz) 200 500 1000 TC = 25C VCE = 4.0 Vdc IC = 3.0 Adc
300 TJ = 25C 200 C, CAPACITANCE (pF)
100 70 50 Cib
Cob
30 0.1
0.2
0.5 1.0 2.0 5.0 10 20 VR, REVERSE VOLTAGE (VOLTS)
50
100
Figure 6. Small-Signal Current Gain
Figure 7. Capacitance
20,000 VCE = 4.0 V 10,000 hFE , DC CURRENT GAIN 5000 3000 2000 25C 1000 -55 C 500 300 200 TJ = 150C
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
3.0 TJ = 25C 2.6 IC = 2.0 A 2.2 4.0 A 6.0 A
1.8
1.4
0.1
0.2 0.3 0.5 0.7 1.0 2.0 3.0 IC, COLLECTOR CURRENT (AMP)
5.0 7.0 10
1.0
0.3
0.5 0.7
1.0
2.0 3.0 5.0 7.0 IB, BASE CURRENT (mA)
10
20 30
Figure 8. DC Current Gain
Figure 9. Collector Saturation Region
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4
2N6387, 2N6388
3.0 V, TEMPERATURE COEFFICIENTS (mV/C) TJ = 25C V, VOLTAGE (VOLTS) 2.5 + 5.0 + 4.0 + 3.0 + 2.0 + 1.0 0 - 1.0 - 2.0 - 3.0 - 4.0 - 5.0 0.1 0.2 0.3 0.5 0.7 1.0 qVB for VBE 25C to 150C -55 C to 25C 2.0 3.0 5.0 7.0 10 *qVC for VCE(sat) -55 C to 25C *IC/IB hFE @ VCE + 4.0 V 3
25C to 150C
2.0 VBE(sat) @ IC/IB = 250 VBE @ VCE = 4.0 V VCE(sat) @ IC/IB = 250 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
1.5
1.0
0.5 0.1
IC, COLLECTOR CURRENT (AMP)
IC, COLLECTOR CURRENT (AMP)
Figure 10. "On" Voltages
Figure 11. Temperature Coefficients
105 REVERSE IC, COLLECTOR CURRENT ( A) 104 103 102 TJ = 150C 101 100 100C EMITTER [ 8.0 k [ 120 VCE = 30 V FORWARD COLLECTOR
BASE
25C 10- 1 -0.6 -0.4 -0.2
0
+0.2 +0.4
+0.6 +0.8
+1.0
+1.2 + 1.4
VBE, BASE-EMITTER VOLTAGE (VOLTS)
Figure 12. Collector Cut-Off Region
Figure 13. Darlington Schematic
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5
2N6387, 2N6388
PACKAGE DIMENSIONS
TO-220AB CASE 221A-09 ISSUE AD
-T- B
4
SEATING PLANE
F T S
C
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 --- --- 0.080 BASE COLLECTOR EMITTER COLLECTOR MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 --- --- 2.04
Q
123
A U K
H Z L V G D N R J
STYLE 1: PIN 1. 2. 3. 4.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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6
2N6387/D


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